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The self-development characteristics of Si containing polymers were investigated with the aim of applying these polymers to the surface-imaging process in X-ray lithography. UV and FT-IR spectra were used to study the reaction of the polymers to soft X-rays. The polymers exhibited positive-tone characteristics when exposed to X-rays. Their self-development sensitivity and oxygen reactive ion etching resistance were measured to estimate the feasibility of their use in lithography.